Application: Surface treatment, Modification, Cleaning, Cutting
Power range: High power > 1 kW
Processing mode: CW + pulsed + Ultra short pulsed

Application: Marking, Labelling, Microstructuring, Micromachining
Power range: up to 400W polarized
Processing regime: CW, including modulation up to 10 MHz

Application: universal (Marking, Microstructuring, Micromachining, LIFT, …)
Power range: Power < 1 kW
Processing mode: CW + pulsed + ultra short pulsed

Application: Drilling, Microstructuring, Micromachining
Power range: Power < 1 kW; 2nd galvo for phase control
Processing regime: pulsed + ultra short pulsed

Application: 2,5 D Engraving
Power range: Power < 1 kW; integrated real-time slicer
Processing regime: pulsed + ultra short pulsed

Processing examples with the devices can also be found on the YouTube channel of the Laserinstitut Hochschule Mittweida.