PM 30 – One device, endless possibilities

Our previous models PM 100, PM 300 and PM 600 are now combined in the PM 30.

Surface treatment

Modification

Cleaning

Cutting

Marking

Microstructuring

Drilling

Perforating

2.5D Engraving

LIFT

moewe-7
moewe-22
moewe-11

Options & Extensions

High Power Mode

Expands the power range above 1 kW – ideal for demanding applications.

Wavelength

Flexible UV and VIS wavelengths for maximum material versatility.

Real-Time Shifter

Dynamic real-time process adjustment – precision at the highest level.

Engraving Module

Special module for precise engravings – perfect for 2.5D and fine structures.

Sync Module

Perfect synchronization with external axes or multiple scanners for complex processes.

PM 30 – Basic & Options Compared

FeaturePM 30 BasicPM 30 with Options
Power Range< 1 kWHigh Power Mode: > 1 kW
WavelengthsStandard (NIR)Option: UV / VIS
ProcessingStandard applications
(surface, cutting, cleaning)
Option: Engraving Module (2.5D, fine structures)
Process ControlBasic softwareOption: Real-Time Shifter
Option: Sync Module
ApplicationsUniversalHigh-end, highly dynamic processes

Your Benefits

  • Two-dimensional beam deflection enables stand-alone operation or integration into production lines
  • Patented low-distortion double polygon mirror
  • Large free aperture of 30 mm
  • Multiple digital and analog I/O ports, Ethernet
  • High laser power up to 5 kW cw
  • Ultra-fast scan speeds across the entire scan field
  • Synchronization of two scanners to one laser source (optional)

Software

  • Parameter, bitmap and vector graphics mode
  • 8-bit grayscale processing, 2.5D engraving
  • 3D real-time slicer (STL files)
  • Synchronization of scanners and external axes

Datasheet PM 30

What Our Customers Say